添运体育

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                ESI’s market-leading CircuitTrim? solutions for thick film chip-R. Incorporating decades of applied laser expertise.

                A high performance chip trim system designed specifically for thick film components down to the latest 01005 products.

                • Spot size down to 20 microns
                • Diode-pumped laser technology for minimum maintenance, long term stability and high reliability
                • Patented beam calibration and vision system for automatic alignment and precise laser positioning
                • High speed handler manages thin substrates used with the latest generation small geometry chip resistors
                • Wide range measurement system
                  • 5 milli-Ohms to 1 Gig Ohm
                  • Traceable measurement certification
                • ChipTrim? Software
                  • Graphical user environment dedicated to chip trimming
                  • Globalized language support

                The LT3100 delivers significantly higher beam control accuracy at a higher level of precision without sacrificing throughput. Since the LT3100 utilizes the same resistor trimming platform for a wide range of production applications, ?customers experience a lower total cost of ownership.

                SUMMARY


                Receive high beam control accuracy and a high level of precision without sacrificing throughput.

                MARKETS:
                • Automotive
                • Medical
                • Aerospace
                APPLICATIONS:
                • Strain gauges
                • Fuel gauges
                • Rotary encoders
                • Pressure sensors
                • Thermistors
                • Temperature Sensors
                • Gearbox controllers
                • Vehicle emission detectors
                • Chip resistors
                MATERIALS:
                • Thick film

                SPECIFICATIONS


                Precision and accuracy in an extensible platform.

                LASER:
                • Type: Diode pumped Q-switched YAG
                • Wavelength: 532nm
                • Output Power / Pulse Width:
                • 3W / 30ns
                • 3W / 70ns (optional)
                • 6W/70ns (optional)
                • Beam positioner type: High-speed closed loop galvanometer
                • Spot Size1: 8 μm - 15 μm
                • Field size: 100 x 100 mm
                • 50 x 50 mm (8 μm spot)
                • 25 x 25 mm (8 μm optional)
                • Depth of Focus: 150 μm 50 μm (8 μm spot)
                • Beam Repeatability: ≤6.0 μm
                • Resolution: 1.52 μm - 0.80 μm (8 μm spot)
                MATERIAL HANDLING:
                • Programmable Z Stage
                • Z Travel: 20mm
                • Z Resolution: 4um
                • Z Repeatability: 4um
                • Theta Travel: ± 5 degrees
                • Theta Resolution: 0.003 degrees
                • Lifting/Probe force: 25 lbs (11.3 kg)

                FEATURES & OPTIONS


                System Features

                • Optional Equipment:
                • Low-ohm option (5 mΩ – 1 Ω):
                • Uses standard 4T probe cards
                • Range 0.005 Ω – 0.1 Ω ±0.50%
                • Accuracy 0.1 Ω - 1 Ω ±0.25%
                • Additional matrix cards
                • Choice of analog cables
                • PCI IO card
                • GPIB interface
                • GPIB instrumentation package
                • Configurable Light Tower
                • Illumination options
                • Service tools and accessories

                For industries facing material transformation challenges in production, ?we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

                See what it's like to be an MKS customer - contact an MKS Sales Expert today