添运体育

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                Laser via drilling system for flex PCB manufacturing.

                Best-in-class high-volume FPC laser drilling machine for flexible PCB Manufacturing.


                Via drilling for flex PCB laser processing. ESI 5335.

                The 5335??is a perfect flex PCB laser processing solution for leading-edge flex circuit manufacturing customers. Now in service at the leading flex PCB manufacturing companies, the 5335 laser via drilling machine is a good fit for customers requiring production-oriented flex PCB via drilling for PCB laser processing. It is also a good fit for general micromachining customers looking to take advantage of the state-of-the-art laser processing technology and applied laser expertise built into the 5335 platform.

                Utilizing ESI’s Third Dynamics? technology, the 5335 delivers industry-leading capabilities for UV laser via drilling and is optimized for processing both flexible circuits and rigid-flexible printed circuit boards. It also addresses other high-accuracy laser processing applications such as routing, patterning, and skiving through a combination of ESI's patented compound beam positioning and solid-state optical technology.

                The Model 5335’s low cost of ownership—along with its high-volume laser manufacturing focus—optimizes your laser processing and production capabilities and puts you in a better position to keep up with the increasingly demanding needs of industries such as consumer electronics, automotive and medical devices.

                SUMMARY


                Laser via drilling and precision laser micromachining

                MARKETS:
                • Flex PCB Laser Processing
                • Rigid-Flex Laser Processing
                • Laser micromachining
                APPLICATIONS:
                • Blind via drilling (BHV)
                • Through via drilling (THV)
                • Routing
                • Patterning
                • Skiving
                • Coverlay routing
                MATERIALS:
                • Polyimide
                • Liquid Crystal Polymer (LCP)
                • Adhesiveless copper-clad polyimide laminates
                • Copper-clad polyimide laminates with adhesive
                • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
                • Coverlay (Polyimide + Adhesive)

                SPECIFICATIONS


                High productivity laser via drilling and laser micromanufacturing

                LASER:
                • Nanosecond UV Nd:YAG - 11 W
                MATERIAL HANDLING:
                • Vacuum chuck - 533mm x 635mm (±20um accuracy)
                • Electrical and software interface for web and panel handler integration

                FEATURES & OPTIONS


                A range of systems for a range of challenges

                • Third Dynamics? beam positioning
                • Precision Pulse? digital power control
                • Automated vision system for alignment and scaling compensation
                • Easy-to-use Windows 7 interface
                • Multi-language operator user interface
                • Sophisticated process development functionality
                • Comprehensive logging and diagnostics functionality

                For industries facing material transformation challenges in production, ?we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

                See what it's like to be an MKS customer - contact an MKS Sales Expert today