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                CO2 via drilling for HDI PCB manufacturing and integrated circuit packaging.


                Step up to new levels of precision when drilling blind and through-hole vias in a broad range of PCB and ICP materials.

                Innovative CO2 laser technology, new control capabilities and applied expertise gained through decades of engineering leadership in flex, combine to deliver breakthrough levels of accuracy, throughput and yield.

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                Geode Features

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                Throughput

                HyperSonixTM
                Sound waves shape laser pulses to improve via quality and increase throughput.



                AcceleDrillTM
                Uses sound waves to distribute light to drill different vias without optics path adjustments (no downtime).?

                Accuracy

                VDCTM
                Via density compensation improves via diameter stability, accuracy and throughput.



                AeroCoreTM
                Integrated structural air flow supports improved thermal?equilibrium and simplified?maintenance.

                Footprint

                LiteDesignTM
                Compact and lightweight system architecture allows for more flexibility in system placement and use on production floor.



                UpTimeTM
                Easy-access design improves serviceability, decreasing maintenance and service downtime.

                SUMMARY


                Geode combines dramatically increased throughput with the accuracy and flexibility required for advanced 5G applications - all in a smaller, lighter package

                MARKETS:
                • Automotive
                • Aerospace
                • Medical
                APPLICATIONS:
                • PCB Manufacturing
                • Integrated Circuit Packaging
                • Substrate Processing
                • System Level Packaging
                MATERIALS:
                • FR4
                • BT
                • ABF
                • PTFE
                • EMC
                • RCC
                • LCP
                • Ceramics
                • Glass

                SPECIFICATIONS


                A focus on accuracy, throughput and versatility

                LASER:
                • Via Diameter Range: 35-200um
                • Panel processing: Dual-head two panel system
                • Throughput: Up to 9500 pps
                • Peak Power: 2.5kW
                • Laser Pulse Frequency: Up to 6.5kHz
                • Average Power: >300W@6.5kHz
                • Processing: CDD/Large Window/Conformal Mask/LTH
                • Scan Area: 20x20mm (ESI’s patented Third DynamicsTM beam positioning technology)
                • Scan Frequency (per head): 5200 points per second (500um pitch)
                • Total System Accuracy: +/- 8um mean +3Σ
                • Energy Monitoring: Real time pulse energy monitoring (programmable alarm settings)
                • Panel Height Detection: Touchdown sensor (calibrated to align with camera focus)
                • Automation Panel Autoloader: std, NG panel, Flipping
                • Automation Accuracy (panel to chuck): 500um
                MATERIAL HANDLING:
                • Panel Size Range: 16”x20” to 22”x24”
                • Panel Thickness Range: 40um - 2000um

                As the recognized leader in flex PCB processing, we have?decades of applied expertise in laser via drilling and production-oriented Flex PCB laser processing. Learn more about our portfolio of laser via drilling systems and see how you can incorporate flex PCB laser processing to help address flex PCB manufacturing challenges.

                Let MKS help fuel your drive for innovation – contact an MKS Representative today.