添运体育

  • <tr id='gOPYRz'><strong id='gOPYRz'></strong><small id='gOPYRz'></small><button id='gOPYRz'></button><li id='gOPYRz'><noscript id='gOPYRz'><big id='gOPYRz'></big><dt id='gOPYRz'></dt></noscript></li></tr><ol id='gOPYRz'><option id='gOPYRz'><table id='gOPYRz'><blockquote id='gOPYRz'><tbody id='gOPYRz'></tbody></blockquote></table></option></ol><u id='gOPYRz'></u><kbd id='gOPYRz'><kbd id='gOPYRz'></kbd></kbd>

    <code id='gOPYRz'><strong id='gOPYRz'></strong></code>

    <fieldset id='gOPYRz'></fieldset>
          <span id='gOPYRz'></span>

              <ins id='gOPYRz'></ins>
              <acronym id='gOPYRz'><em id='gOPYRz'></em><td id='gOPYRz'><div id='gOPYRz'></div></td></acronym><address id='gOPYRz'><big id='gOPYRz'><big id='gOPYRz'></big><legend id='gOPYRz'></legend></big></address>

              <i id='gOPYRz'><div id='gOPYRz'><ins id='gOPYRz'></ins></div></i>
              <i id='gOPYRz'></i>
            1. <dl id='gOPYRz'></dl>
              1. <blockquote id='gOPYRz'><q id='gOPYRz'><noscript id='gOPYRz'></noscript><dt id='gOPYRz'></dt></q></blockquote><noframes id='gOPYRz'><i id='gOPYRz'></i>

                Affordable versatility in a CO2 laser solution for HDI via drilling. Leverage ESI’s laser expertise for PCB and substrate processing.


                High-Density Interconnect

                High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale. ESI’s HDI systems enable HDI manufacturers to drill vias in a broad range of copper-clad base materials such as glass-woven reinforced epoxy resins (FR4) or other specialty materials. For PCB manufacturers of HDI boards, CO2 laser processing is the optimal choice for overall lower cost of ownership.

                ESI leverages our expertise in laser processing and our proven track record of success in laser-based systems — especially in the flexible PCB manufacturing segment, where ESI is the clear market leader — and applies it to the HDI manufacturing segment. Our solutions are engineered to provide great reliability at high-quality output with the industry’s lowest cost of ownership, and backed by ESI’s professional service and support organization with local offices through the world.

                HIGH DENSITY INTERCONNECT SOLUTIONS


                CO2 via drilling for HDI PCB manufacturing.

                Take advantage of a powerful new CO2 laser and a new set of control capabilities that leverage ESI’s decades of laser-material interaction experience and application expertise to help you innovate and stay ahead.

                GeodeTM is ESI’s most advanced HDI microvia drilling solution for precision processing of a wide range of applications. Geode’s compact and lightweight system architecture allows for more flexibility in system placement and use on production floor.

                learn more about Geode

                APPLICATIONS:
                • PCB Manufacturing
                • Integrated circuit packaging
                • Substrate processing
                • System level packaging
                MATERIALS:
                • FR4
                • BT
                • ABF
                • PTFE
                • EMC
                • RCC
                • LCP
                • Ceramics
                • Glass

                For industries facing material transformation challenges in production, ?we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

                See what it's like to be an MKS customer - contact an MKS Sales Expert today